High-yield production energy, stable packaging foundry for IC Smart card & chip module packaging services. Manufacturing contactless IC module packaging, contact IC module packaging, and Smart card chip IC card design and production. Important advantages: 1. Master advanced packaging technology and equipment, provide standard packaging specifications, 2. A member of the ChipBond Technology Group, a listed company group, 3. Competitive product prices, ultra-high quality, 4. Years of experience in IC Smart card & chip module foundry in major international manufacturers.
