The contactless smart card module MOA4 with a height (maximum) of only 330 microns (0.33mm) meets the standard specifications of international smart card chip manufacturers such as NXP (MOA4), STMicroelectronics (CB4), Infineon, etc.
Maximum height only 330 μm (0.33 mm), compatible with NXP MOA4, ST CB4, and Infineon naming conventions. Stable mass production, high yield, and reel tape supply for automated assembly.
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MOA4 is a Contactless Smart Card Chip Module engineered with an ultra-thin 0.33 mm profile to meet strict card lamination and flatness requirements. It aligns with international naming conventions (NXP MOA4, ST CB4, Infineon) and suits banking cards, transportation tickets, access control cards, and government ID documents.
MOA4 combines ultra-thin design with international compatibility, ensuring manufacturability and long-term reliability for high-volume card production.
| Item | Specification |
|---|---|
| Module type | Contactless Smart Card Chip Module |
| Maximum height | 330 μm (0.33 mm) |
| Lead frame | Material: CuSn6; Plating: Silver; Flash 1.5 ± 0.5 μm; Spot 4 ± 1 μm; Total thickness: 60 ± 5 μm |
| Chip adhesive | Epoxy resin, non-conductive |
| Bond wire | Au wire (99.99%), Ø 0.9 mil |
| Encapsulation | Epoxy molding compound, black, fully cured |
| Allowable temperature range | -25 ℃ to +85 ℃ |
| Allowable storage conditions | 15 ℃ ~ 30 ℃, <85% RH; up to 0.5 year in original packing |
| Module dimensions | Refer to Figure 1 outline; all dimensions in mm (includes reject hole, chamfers, and radii) |
| Reel definition | Ø330 mm reel; refer to Figure 2; all dimensions in mm |
| Endless tape on reel | Refer to Figure 3 winding specifications; label area, chip side, non-encapsulation side, interleaf film |
| Typical packing quantity | Maximum 12,000 modules per reel |
| Splicing specification | Adhesive tape width 16 mm; thickness 0.07 mm; sprocket holes must be free of tape; reject hole punched at splice area (Figure 4) |
| Reliability standards | Periodic tests per MIL-STD-883, IEC68-2, ISO 10373 |
| Reliability—temperature cycle | -40 ℃ / 85 ℃ (30 min / 30 min), 100 cycles; sample 22; MIL-STD-883-1010.7 |
| Reliability—temperature humidity | 40 ℃ / RH 93%, 200 hours; sample 22; IEC 68-2-3 |
| Reliability—high temperature storage | 85 ℃, 200 hours; sample 22; MIL-STD-883-1008.2 |
| Reliability—resistance to chemicals | 25 ℃ / 5% NaCl, 1 minute; sample 5; ISO 10373 |
| Reliability—bending properties | Mechanical stress, 1000 cycles; sample 22; ISO 10373-1 |
| Reliability—torsion properties | Mechanical stress, 1000 cycles; sample 22; ISO 10373-1 |
| Packing regulations—shipping label | Label size 125 × 40 mm; fields include Customer PO, Package/Type, Wafer Lot, Lot, P/N, Date, Quantity |
| Packing regulations—dry packing | Aluminum bag dry packing; paper ring around reel; shipping label and ESD attention label applied; silica gel 66 g (33 g × 2) and humidity indicator inside |
Note: Long-term storage over 1 year or operation at extreme temperatures (near -25 ℃ or +85 ℃) may affect module lifetime, quality, and processability.
MOA4’s maximum height is only 330 μm (0.33 mm), meeting stricter card thickness and flatness requirements while remaining compatible with international naming conventions.
Yes. Supplied on Ø330 mm reels with up to 12,000 modules per reel, with winding and splicing specifications for automated lines.
Periodic testing per MIL-STD-883, IEC68-2, and ISO 10373, covering temperature cycling, humidity, high-temperature storage, chemical resistance, bending, and torsion.
15–30 ℃, <85% RH, up to 0.5 year in original packing. Extended storage or extreme temperatures may impact lifetime and quality.
Yes. Packaging or testing specifications can be customized under NDA for project-specific requirements.
We provide sampling and mass production services, reel tape supply, and quality inspection processes—ideal for banking, transit, access control, and ID applications.
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(80248)24F-5, No.31, Haibian Rd., Lingya Dist., Kaohsiung City 802, Taiwan (R.O.C.) E-mail : service@chilitag.com.tw
