The contactless smart card module MOB6 with a height (maximum) of only 250 microns (0.25mm) meets the standard specifications of international smart card chip manufacturers such as NXP (MOB6), STMicroelectronics (CB6), Infineon, etc.

MOB6 Contactless Smart Card Chip Module — Ultra-thin 0.25 mm

Maximum height only 250 μm (0.25 mm), compatible with NXP MOB6, ST CB6, and Infineon naming conventions. Stable mass production, high yield, and reel tape supply for automated assembly.

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Product positioning

MOB6 is a Contactless Smart Card Chip Module engineered with an ultra-thin 0.25 mm profile to meet strict card lamination and flatness requirements. It aligns with international naming conventions (NXP MOB6, ST CB6, Infineon) and suits government IDs, e-passports, transit tickets, and banking/payment cards.

Key features

• Ultra-thin thickness: Maximum height 250 μm (0.25 mm), thinner than typical MOA-series modules.
• International compatibility: Compatible with NXP (MOB6), STMicroelectronics (CB6), and Infineon naming conventions.
• Premium materials: CuSn6 lead frame, silver plating, gold bonding wire, epoxy resin encapsulation.
• Reliability verified: Periodic testing per MIL-STD-883, IEC68-2, and ISO 10373.
• Reel tape supply: Ø330 mm reels, up to 12,000 modules per reel, supporting automated assembly.
• High-yield mass production: Consistent quality with rigorous packaging and labeling standards.

Application scenarios

• Government ID documents (e-passports, national ID cards, driver’s licenses)
• Public transit tickets and transportation cards
• Banking and payment cards
• Membership cards and hotel room keys
• Contactless wristbands and wearable devices
• Livestock management electronic tags

MOB6 combines ultra-thin design and international compatibility, ensuring manufacturability and long-term reliability for high-volume card production.

Technical specifications

Item	Specification
Module type	Contactless Smart Card Chip Module
Module dimensions	5.0 × 8.0 mm
Black epoxy size	4.9 × 5.1 mm
Module thickness	0.25 mm ± 0.01 mm
Lead frame	CuSn6, thickness 64 ± 5 μm
Plating	Flash plating 1.5 ± 0.5 μm; Spot plating 4 ± 1 μm
Bond wire	Au wire (99.99%), Ø 1.0 mil
Encapsulation	Epoxy molding compound, black, fully cured
Temperature range	-25 ℃ ~ +85 ℃
Storage conditions	15 ℃ ~ 30 ℃, <85% RH; up to 0.5 year in original packing
Reel supply	Ø330 mm reel, maximum 12,000 modules/reel
Splicing specification	Adhesive tape width 16 mm, thickness 0.07 mm; sprocket holes must remain free; reject hole punched at splice area
Reliability tests	Temperature cycling, humidity, high-temp storage, chemical resistance, bending, torsion; compliant with MIL-STD-883, IEC68-2, ISO 10373
Packing method	Dry-packed in aluminum bag; paper ring around reel; shipping label and ESD attention label applied; silica gel 66 g (33 g × 2) and humidity indicator inside

Note: Long-term storage over 1 year or operation at extreme temperatures (-25 ℃ ~ +85 ℃) may affect module lifetime, quality, and processability.

FAQ

What differentiates MOB6 from MOA-series modules?

MOB6 thickness is only 250 μm (0.25 mm), thinner than MOA4 (330 μm) and MOA2 (390 μm), meeting stricter card thickness and flatness requirements.

Does MOB6 support reel tape supply and automated assembly?

Yes. Supplied on Ø330 mm reels with up to 12,000 modules per reel, with winding and splicing specifications for automated lines.

How is reliability verified?

Periodic testing per MIL-STD-883, IEC68-2, and ISO 10373, covering temperature cycling, humidity, high-temperature storage, chemical resistance, bending, and torsion.

Recommended storage and usage conditions?

15–30 ℃, <85% RH, up to 0.5 year in original packing. Extended storage or extreme temperatures may impact lifetime and quality.

Is customization available?

Yes. Packaging or testing specifications can be customized under NDA for project-specific requirements.

Downloads

• MOB6 product page (spec highlights)
• Request full specification / reliability & packaging (PDF)

Related products

• MOA4 — Contactless smart card chip module, 0.33 mm
• MOA2 — Contactless smart card chip module, 0.39 mm
• Smart card chip packaging portfolio (Contact / Dual Interface / Contactless)

Start with MOB6 Contactless Smart Card Chip Module

We provide sampling and mass production services, reel tape supply, and quality inspection processes—ideal for government IDs, transit tickets, and payment cards.

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