Contact Module 8 PIN is to package the SMARTCARD CHIP (smart card chip, security chip, SIM, etc.) into a module with a 6PIN contact interface that complies with the ISO 7816 standard.

The Smartcard Contact 8pin module (Gold / Glob Top) is used to embed an integrated circuit into the smart card to realize the contact connection between the IC smart card and the reader. Contact IC smart card modules are usually used in bank cards, telecommunication cards, transportation cards and government applications.

Relying on years of experience in the semiconductor industry, CHILITAG Technology continues to develop ultra-thin technology, and can produce Smartcard Contact 6pin module (Gold / Glob Top) with high efficiency and high yield, which is in line with international smart card chip manufacturers such as NXP NXP , STMicroelectronics STMicroelectronics, Infineon Infineon and other standard specifications, over the years have provided international customers with contact IC smart card module packaging services, reaching more than tens of millions each year.

Smartcard Contact 8pin module (Gold / Glob Top) are mainly used for IC smart cards, and can also be applied to other contact IC smart card module solutions, such as transportation tickets, membership cards, mobile phone SIM cards and other security authentication applications.

Smartcard Contact 8pin module (Gold / Glob Top) DRAWING：

MANUFACTURING PROCESS：

The contact IC smart card module production plant meets the relevant ISO international certification requirements, ROHS and other international material specifications. CHILITAG provides a one-stop service for the production of contact IC smart card module packaging, from wafer to final contact IC smart card module. Fully customized service of Chip Module.

Lead Frame SPECIFICATION:

Base material: Epoxy Glass

Adhesive: Epoxy

Contact side Copper : Electro Deposited Copper

Totalthickness : 160+/-10um